Moisture Proof Multilayer Circuit Board , 0.3mm Hole Dimension High Reliability

Quick Detail:

Description:

The main technical indicators

1. Max size: single sided, double sided:600mm * 500mm Multi-layer: 400mm * 600mm
2. Processing thickness:0.2mm -4.0mm

3 Copper foil substrate thickness: 18μ(1/ 2OZ ),35μ( 1OZ ),70μ( 2OZ )
4 Common material: FR-4 , CEM-3 , CEM-1, Polytetrachloroethylene,FR-1(94V0,94HB)
5. Light copper,Nickel-plated,Gilded,HALImmersion Gold,Antioxidant,HASL,Immersion Tin,etc.

Process Capability

1. Drilling:The minimum diameter 0.1mm

2. Hole metallization:Minimum aperture 0.2mm,Thickness / aperture ratio 4:1

3. Wire width: Minimum:Gold plate 0.10mm, Tin plate0.1mm

4. Wire spacing: Minimum:Gold plate 0.10mm, Tin plate0.1mm

5. Gold plate: nickel layer thickness:2.5μ,Gold layer thickness: 0.05-0.1μm or according to customer requirements

6. HASL: tin layer thickness:2.5-5μ

7. Paneling: Line-to-edge minimum distance: 0.15mm hole to edge minimum distance: 0.15mm smallest form tolerance: ± 0.1mm

8. Socket chamfer: Angle: 30 degrees, 45 degrees, 60 degrees Depth: 1-3mm

9. V Cut: Angle: 30 degrees, 35 degrees, 45 degrees Depth: thickness 2/3 Minimum size: 80mm * 80mm

Applications:

1. The mobile phone

Focuses on the flexible circuit board light weight and thin thickness. Can effectively save the volume of products, easy connection of the battery, microphone, and buttons and into one.

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